ISO uses the term, Integrated Circuit Card (ICC) to encompass all those devices where an integrated circuit is contained within an ISO ID1 identification card. Identification cards — Integrated circuit(s) cards with contacts — Part 1: Physical characteristics. ISO/IEC specifies the physical characteristics of integrated circuit cards with contacts. It applies to identification cards of the ID-1 card type, which.
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This is a low cost memory, in that it occupies minimum space on the silicon substrate.
The former is easy to identify because of its gold connector plate figure 1. While this is certainly one way of comparing cards fabricated by different companies, whether it bears any relationship to the use of IC cards in the 78116-1 seems debatable. The IC should still be operational at the end 7816-11 the test. Wire bonding is the most commonly used technique in the manufacture of Smart Cards.
In some ways this is still a relatively immature part of the Smart Card standards since the early applications used the Smart Card largely as a data store with some simple security features such as PIN checking.
Although the integrated circuit could contain its own clock circuit for driving the internal logic, in practice most IC chips are supplied with an external clock by the interface device. Conformance to ISO standards is also likely to be a requirement and in this area ISO – 3 Iwo signals and transmission protocols is the principle standard to be considered.
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Whilst the memory is erasable by means of ultra violet light, the necessary quartz window is never available in the ICC and the memory is really used in one time programmable mode OTP.
The first three parts in particular are well established and allow total physical and electrical interoperability as well as defining the communication protocol between the IC card and kso CAD Card Acceptor Device. This device often consists of a movable carriage that positions the card under the connector head while applying the necessary wiping and pressure action.
This allows a far more flexible approach since the application can be loaded into the chip after manufacture.
The latter frequency has a simple divisor of in order to achieve a bit per second communication speed. Technical Adviser to Smart Card News. In practice this cannot be instantaneous and the expression “line turnaround time” is commonly encountered in the modem world. Area 1 is for the number identifying both iao card issuer and the card holder.
7861-1 half duplex refers only to data transmissions in one direction at a time which a PC is perfectly capable of managing with its UART. The transmission protocol must take account of this need to turn the line around.
The ISO standard defines a single line for the interchange of data between the IC and the interface device. The Sio deactivation sequence for the interface device is as follows: We might like to conjecture on which is the better position for the chip in terms of mechanical stress but perhaps we should just settle for agreement.
It is even proposed that the chip micromodule could be inserted in one step as part of the moulding process. One of the issues surrounding the use of the IC card relates to the temperature range for operational use. More commonly the die are is from the wafer by the use of a diamond saw. The ICC really does provide a tamper resistant domain that is difficult to match with the somewhat larger security boxes that handle cryptographic processes.
ISO includes the commands for internal security management of the card and may include encryption techniques and other security management methods. Let us consider first the purpose for the 6 contacts used by the ICC figure 2. The security logic can be used to control access to the memory for authorised use only. The bending properties are tested by deflecting the card on each axis as shown in figure 6. It includes the following:. There is another bi-product that we will consider later where the cost of isi and personalisation are considerably altered by the complexity of the particular chip.
The final operation in the manufacturing process is to enable the application for operation.
This article is iiso on page 2. As mentioned previously, security may be an important issue for the application and accordingly there may be extra requirements on the physical and logical security offered by the particular chip.
ISO3. Part 3 Location of embossed characters on ID -1 cards.
It specifies the physical characteristics, layout, recording techniques, numbering system and registration procedures. The specification of a card involves parameters that are common to many existing applications using the ISO ID-1 card.
The standard defines the situation after reset whilst allowing the frequency to be selectively changed by means of protocol type selection. ios